High voltage devices and methods of forming the high voltage devices

ABSTRACT

A high voltage (HV) device includes a well region of a first dopant type disposed in a substrate. A first well region of a second dopant type is disposed in the well region of the first dopant type. An isolation structure is at least partially disposed in the well region of the first dopant type. A first gate electrode is disposed over the isolation structure and the first well region of the second dopant type. A second well region of the second dopant type is disposed in the well region of the first dopant type. The second well region of the second dopant type is spaced from the first well region of the second dopant type. A second gate electrode is disposed between and over the first well region of the second dopant type and the second well region of the second dopant type.

FIELD OF THE DISCLOSURE

The present application relates generally to the field of semiconductorcircuits, and more particularly, to high voltage devices and methods offorming the high voltage devices.

BACKGROUND

The demand for evermore compact, portable, and low cost consumerelectronic devices has driven electronics manufacturers to develop andmanufacture integrated circuits (IC) that operate with low power supplyvoltages resulting in low power consumption. There may be components ofthe devices that require higher voltages than the low power supplyvoltage. For example, liquid crystal display (LCD) drivers may use highvoltage (HV) MOS transistors for driving LCD pixels.

SUMMARY

In one embodiment, a high voltage (HV) device includes a well region ofa first dopant type disposed in a substrate. A first well region of asecond dopant type is disposed in the well region of the first dopanttype. An isolation structure is at least partially disposed in the wellregion of the first dopant type. A first gate electrode is disposed overthe isolation structure and the first well region of the second dopanttype. A second well region of the second dopant type is disposed in thewell region of the first dopant type. The second well region of thesecond dopant type is spaced from the first well region of the seconddopant type. A second gate electrode is disposed between and over thefirst well region of the second dopant type and the second well regionof the second dopant type.

In a second embodiment, a method of forming a high voltage (HV) deviceincludes forming a well region of a first dopant type disposed in asubstrate. A first well region of a second dopant type is formed in thewell region of the first dopant type. An isolation structure is at leastpartially formed in the well region of the first dopant type. A firstgate electrode is formed over the isolation structure and the first wellregion of the second dopant type. A second well region of the seconddopant type is formed in the well region of the first dopant type. Thesecond well region of the second dopant type is spaced from the firstwell region of the second dopant type. A second gate electrode is formedbetween and over the first well region of the second dopant type and thesecond well region of the second dopant type.

These and other embodiments of the present disclosure, as well as itsfeatures are described in more detail in conjunction with the text belowand attached figures.

BRIEF DESCRIPTION OF THE DRAWINGS

The present disclosure is best understood from the following detaileddescription when read with the accompanying figures. It is emphasizedthat, in accordance with the standard practice in the industry, variousfeatures are not drawn to scale and are used for illustration purposesonly. In fact, the numbers and dimensions of the various features may bearbitrarily increased or reduced for clarity of discussion.

FIG. 1 is a schematic cross-sectional view of a first exemplaryembodiment of a high voltage (HV) device.

FIG. 2 is a schematic cross-sectional view of a second exemplaryembodiment of a HV device.

FIG. 3 is a schematic drawing illustrating an exemplary simulationresult showing an increase of the drain-to-source current of anexemplary embodiment of an HV device.

FIGS. 4A-4D are cross-sectional views of an exemplary embodiment of amethod of forming an HV device.

FIG. 5 is a schematic drawing of a system that includes an exemplaryembodiment of an integrated circuit disposed over a substrate board.

DETAILED DESCRIPTION

A first conventional HV MOS transistor has an isolation structure. Theisolation structure may be, for example, a shallow trench isolation(STI) structure or a local oxidation of silicon (LOCOS) structure, undera gate electrode of the conventional HV device. The conventional HVdevice having the isolation structure under the gate electrode can havea desired breakdown voltage. Conventionally, the STI structure or theLOCOS structure has a thickness in the range of thousands of angstroms.

A second conventional HV device has an insulated gate field-effectdevice structure. The gate field-effect device structure has a drain anda source. The drain is formed with an extended well region having one ormore buried layers of opposite conduction type sandwiched therein. Theone or more buried layers create an associated plurality of parallelconduction channels in the extended portion of the well region.

Based on the foregoing, HV devices and methods for forming the HVdevices are desired.

It is understood that the following disclosure provides many differentembodiments, or examples, for implementing different features of thedisclosure. Specific examples of components and arrangements aredescribed below to simplify the present disclosure. These are, ofcourse, merely examples and are not intended to be limiting. Inaddition, the present disclosure may repeat reference numerals and/orletters in the various examples. This repetition is for the purpose ofsimplicity and clarity and does not in itself dictate a relationshipbetween the various embodiments and/or configurations discussed.Moreover, the formation of a feature on, connected to, and/or coupled toanother feature in the present disclosure that follows may includeembodiments in which the features are formed in direct contact, and mayalso include embodiments in which additional features may be formedinterposing the features, such that the features may not be in directcontact. In addition, spatially relative terms, for example, “lower,”“upper,” “horizontal,” “vertical,” “above,” “below,” “up,” “down,”“top,” “bottom,” etc. as well as derivatives thereof (e.g.,“horizontally,” “downwardly,” “upwardly,” etc.) are used for ease of thepresent disclosure of one feature's relationship to another feature. Thespatially relative terms are intended to cover all possible orientationsof the device including the features.

FIG. 1 is a schematic cross-sectional view of an exemplary high voltage(HV) device. In FIG. 1, an HV device 100 can include a well region 105of a first dopant type, for example, n-type dopant, disposed in asubstrate 101. In embodiments, the HV device 100 can be referred to asan HV laterally diffused MOS (HV LDMOS) transistor, an HV extended drainMOS (HV EDMOS) transistor, or any other HV device.

In embodiments, the substrate 101 can include an elementarysemiconductor including silicon or germanium in a single crystal form, apolycrystalline form, or an amorphous form; a compound semiconductormaterial including at least one of silicon carbide, gallium arsenide,gallium phosphide, indium phosphide, indium arsenide, and indiumantimonide; an alloy semiconductor material including at least one ofSiGe, GaAsP, AlInAs, AlGaAs, GaInAs, GaInP, and GaInAsP; any othersuitable material; or combinations thereof. In one embodiment, the alloysemiconductor substrate may be a SiGe alloy with a gradient SiGe featurein which the Si and Ge composition change from one ratio at one locationto another ratio at another location of the gradient SiGe feature. Inanother embodiment, the SiGe alloy is formed over a silicon substrate.In some embodiments, a SiGe alloy can be mechanically strained by othermaterials in contact with the SiGe alloy. Furthermore, the semiconductorsubstrate may be a semiconductor on insulator, such as silicon oninsulator (SOI), or a thin film transistor (TFT). In some examples, thesemiconductor substrate may include a doped epi layer or a buried layer.In other examples, the compound semiconductor substrate may have amultilayer structure, or the substrate may include a multilayer compoundsemiconductor structure.

The well region 105 can be referred to as a drift region. Well region105 has a first edge 105 a to the right of the HV device 100 and asecond edge 105 b to the left of the HV device 100. In some embodiments,the well region 105 can have a dopant type opposite to that of thesubstrate 101. In other embodiments, the well region 105 can have adopant concentration that is higher than that of the substrate 101.

Referring to FIG. 1, the HV device 100 can include at least oneisolation structure 107, at least partially disposed in the well region105. The isolation structure 107 can include a structure of a localoxidation of silicon (LOCOS), a shallow trench isolation (STI)structure, and/or any other suitable isolation structure.

The HV device 100 can include at least one well region, for example,well regions 110 a-110 d, of a second dopant type, e.g., a p-typedopant. The well regions 110 a-110 d can be disposed in the well region105. The well regions 110 a-110 d can be spaced from each other. Inembodiments, the well regions 110 a-110 d can have dopant concentrationsthat are higher than that of the well region 105 and/or the oppositedopant type to that of the well region 105.

The HV device 100 can include at least one gate electrode, for example,gate electrodes 120 a-120 d. The gate electrode 120 a can be disposedbetween and over the well region 110 a and the isolation structure 107.Each of the gate electrodes 120 b-120 d can be disposed between and overany two neighboring well regions of the well regions 110 a-110 d. Inembodiments, the gate electrodes 120 a-120 e can be coupled with eachother.

In embodiments, the gate electrodes 120 a-120 e can include polysilicon,silicon-germanium, at least one metallic material including elements andcompounds such as, Mo, Cu, W, Ti, Ta, TiN, TaN, NiSi, CoSi, and/or othersuitable conductive materials known in the art. In other embodiments,the gate electrodes 120 a-120 e can include a work function metal layersuch that it provides a metal gate with an N-type-metal work function orP-type-metal work function. P-type-metal work function materials includecompositions such as ruthenium, palladium, platinum, cobalt, nickel, andconductive metal oxides, and/or other suitable materials. N-type metalwork function materials include compositions such as hafnium, zirconium,titanium, tantalum, aluminum, metal carbides (e.g., hafnium carbide,zirconium carbide, titanium carbide, and aluminum carbide), aluminides,and/or other suitable materials.

In embodiments, a gate dielectric structure (not labeled) can bedisposed below each of the gate electrodes 120 a-120 e. The gatedielectric structure can have a single layer or a multi-layer structure.In embodiments for multi-layer structures, the gate dielectric structurecan include an interfacial layer and a high-k dielectric layer. Theinterfacial layer can include dielectric material such as, siliconoxide, silicon nitride, silicon oxinitride, other dielectric material,and/or the combinations thereof. The high-k dielectric layer can includehigh-k dielectric materials such as HfO₂, HfSiO, HfSiON, HfTaO, HfTiO,HfZrO, other suitable high-k dielectric materials, and/or combinationsthereof. The high-k material may further be selected from metal oxides,metal nitrides, metal silicates, transition metal-oxides, transitionmetal-nitrides, transition metal-silicates, oxynitrides of metals, metalaluminates, zirconium silicate, zirconium aluminate, silicon oxide,silicon nitride, silicon oxynitride, zirconium oxide, titanium oxide,aluminum oxide, hafnium dioxide-alumina alloy, other suitable materials,and/or combinations thereof.

In embodiments, the HV device 100 can optionally include a buried wellregion 103 of the first dopant type, e.g., an n-type dopant. The buriedwell region 103 can be disposed between the substrate 101 and the wellregion 105. In embodiments using an N-type HV device, the buried wellregion 103 can have an n-type dopant that is opposite to that of thesubstrate 101.

In embodiments, the HV device 100 can optionally include a well region109 of the second dopant type, e.g., a p-type dopant. The well region109 can be disposed between the buried well region 103 and the wellregion 105. The well region 109 can be coupled with the well region 110a. The well region 109 can be shorter than the buried well region 103 inthe cross-sectional view shown in FIG. 1. In embodiments using an N-typeHV device, the well region 109 can have a p-type dopant that is oppositeto that of the buried well region 103. It is noted that the dopant typesand/or locations of the buried well region 103, the well region 105, thewell region 109, and/or the well regions 110-110 d described above aremerely exemplary. One of skill in the art would be able to modify themto achieve a desired HV device.

Referring to FIG. 1, the HV device 100 can include a doped region 111 ofthe first dopant type, e.g., n-type dopant. The doped region 111 can bedisposed in the well region 105. In some embodiments, doped region 111is disposed between first edge 105 a and isolation structure 107. Insome embodiments, well region 105 does not have another drain regionbetween the isolation structure and the second edge 105 b. Inembodiments using an N-type HV device, the doped region 111 can have ann-type dopant as same as the well region 105. The doped region 111 canbe referred to as a drain region of the HV device 100. For embodimentsforming N-type HV devices, the doped region 111 can have dopants such asArsenic (As), Phosphorus (P), other group V elements, or anycombinations thereof. For embodiments forming P-type HV devices, thedoped region 111 can have dopants such as boron (B), other group IIIelements, or any combinations thereof.

In embodiments operating the HV device 100, the doped region 111 canreceive a first voltage, for example, between about 10 V to about 100 V.The well region 110 a can receive a second voltage, e.g., a groundvoltage or 0 V, that is smaller than the first voltage. The gateelectrode 120 a can receive a third voltage that can turn on a channelunder the gate electrode 120 a. By applying the voltages to the dopedregion 111, the well region 110 a, and the gate electrode 120 a, a firstelectronic current can flow from the well region 110 a through the wellregion 105 to the doped region 111.

In embodiments, each of the well regions 110 b-110 d can receive thesecond voltage, e.g., a ground voltage or 0 V, that is smaller than thefirst voltage. Each of the gate electrodes 120 b-120 e can receive thethird voltage that can turn on a channel under each of the gateelectrodes 120 b-120 e, respectively. For example, by applying thevoltages to the doped region 111, the well region 110 b, and the gateelectrode 120 b, a second electronic current can flow from the wellregion 110 b through the well region 105 and the buried well region 103to the doped region 111. Similarly, additional electronic currents canflow from the well region 110 c-110 d through the well region 105 andthe buried well region 103 to the doped region 111. With the electroniccurrents flowing from the well regions 110 a-110 d to the doped region111, the total on-state current of the HV device 100 can be increased.By increasing the total current of the HV device 100, thedrain-to-source on resistance R_(dson) of the HV device 100 can bedesirably reduced.

In some embodiments, doped regions 113 a-113 d and 115 a-115 d can bedisposed in the well regions 110 a-110 d, respectively. The dopedregions 115 a-115 d can have, for example, the same dopant type as thewell regions 110 a-110 d. The doped regions 113 a-113 d can have thedopant type that is opposite to that of the well regions 110 a-110 d.The doped regions 113 a-113 d can be referred to as source regions ofthe HV device 100. In some embodiments, the doped regions 111, 113 a-113d, and 115 a-115 d can include a silicide structure (not shown). Thesilicide structure may comprise materials such as nickel silicide(NiSi), nickel-platinum silicide (NiPtSi), nickel-platinum-germaniumsilicide (NiPtGeSi), nickel-germanium silicide (NiGeSi), ytterbiumsilicide (YbSi), platinum silicide (PtSi), iridium silicide (IrSi),erbium silicide (ErSi), cobalt silicide (CoSi), other suitablematerials, and/or combinations thereof.

In some embodiments applying the voltages to the well regions 110 a-110d, the gate electrodes 120 a-120 e, and the doped region 111, a contactplug 135 a can be disposed in a dielectric structure 130. The contactplug 135 a can be electrically coupled with the doped region 111. Acontact plug 135 b can be electrically coupled with the gate electrode120 a. Contact plugs 135 c-135 f can be electrically coupled with thedoped regions 113 a-113 d and 115 a-115 d, respectively. In embodiments,butting contacts (not labeled) can be disposed between the contact plugs135 c-135 f and the doped regions 113 a-113 d and 115 a-115 d,respectively. The dielectric structure 130 may include materials such asoxide, nitride, oxynitride, low-k dielectric material, ultra low-kdielectric material, or any combinations thereof. In embodiments, thecontact plugs 135 a-135 f can include materials such as tungsten,aluminum, copper, titanium, tantalum, titanium nitride, tantalumnitride, nickel silicide, cobalt silicide, other proper conductivematerials, and/or combinations thereof.

Referring to FIG. 1, metal layers 140 a-140 f can be disposed over thedielectric structure 130 and electrically coupled with the contact plugs135 a-135 f, respectively. In embodiments, the metal layers 140 a-140 fcan include materials such as tungsten, aluminum, copper, titanium,tantalum, titanium nitride, tantalum nitride, nickel silicide, cobaltsilicide, other proper conductive materials, and/or combinationsthereof. In embodiments operating the HV device 100 at a voltage ofabout 100 V or below, the metal layers 140 a and 140 b are substantiallyfree from extending in the channel direction under the gate electrodes120 a and/or 120 b. The metal layers 140 a and 140 b can be extended ina direction orthogonal to the channel direction.

FIG. 2 is a schematic cross-sectional view illustrating a secondexemplary embodiment of an HV device. Features of the HV device 200shown in FIG. 2 that correspond with the same features of the HV device100 in FIG. 1 are indicated in FIG. 2 by corresponding referencenumerals, incremented by 100.

Referring to FIG. 2, an electrode structure 220 f can be disposed overthe isolation structure 207. The electrode structure 220 f can beelectrically coupled with a metal layer 240 a through a contact plug 235g. In some embodiments, the metal layers 240 a and 240 b can extend inthe same direction as the channel direction under the gate electrodes220 a and/or 220 b. Edges of the metal layers 240 a and 240 b can extendtoward the center of the isolation structure 207.

In some embodiments, a dielectric structure 241 can be disposed over themetal layers 240 a-240 f. Via plugs 245 a and 245 b can be disposed inthe dielectric structure 241, electrically coupling the metal layers 240a-240 b with metal layers 250 a-250 b, respectively. In someembodiments, the metal layers 250 a and 250 b can extend along thechannel direction under the gate electrodes 220 a and/or 220 b. Edges ofthe metal layers 250 a and 250 b can extend further toward the center ofthe isolation structure 207. By extending the metal layers 240 a-240 band/or 250 a-250 b, the breakdown voltage of the HV device 200 can beabout 100 V or more, e.g., up to about 1,200 V.

FIG. 3 is a schematic drawing illustrating a simulation result showingan increase of the drain-to-source current of the HV device 200. In FIG.3, the vertical axis represents a current flowing at a specific depththrough the HV device 200 in units of A/cm². The horizontal axisrepresents the depth in the HV device 200 at which the current flows inunits of μm. The simulation is taken at the cross-sectional line A shownin FIG. 2. In FIG. 3, the current I₁ can flow between the doped region211 and the well region 210 a. The current I₁ can be concentrated closeto the bottom surface of the isolation structure 207. The currents I₂and I₃ can flow between the well regions 210 b-210 c and the dopedregion 211, respectively. The currents I₂ and I₃ can be concentratedsome distance from the bottom surface of the isolation structure 207.The currents I₂ and I₃ can increase the total current of the HV device200 beyond that of I₁ alone. By increasing the total on-state current ofthe HV device 200, the drain-to-source on resistance R_(dson) of the HVdevice 200 can be desirably reduced.

FIGS. 4A-4D are cross-sectional views illustrating an exemplary methodof forming an exemplary HV device. Features of the HV device formed bythe method described in conjunction with FIGS. 4A-4D that correspondwith the same features of the HV device 100 in FIG. 1 are indicated inFIGS. 4A-4D by corresponding reference numerals, incremented by 300.

In FIG. 4A, a buried well region 403 can be formed in a substrate 401. Awell region 405 can be formed in the substrate 401 and over the buriedwell region 403. In some embodiments, the buried well region 403 and thewell region 405 can be formed by any suitable process, such as ionimplantation and/or a rapid thermal process (RTP) to activate the dopedregions.

Referring to FIG. 4B, a well region 409 can be formed between the buriedwell region 403 and the well region 405. At least one well region, forexample, well regions 410 a-410 d, can be formed in the well region 405.The well regions 410 a-410 d can be spaced from each other. The wellregion 410 a can be electrically coupled with the well region 409. Anisolation structure 407 can be formed over the well region 405.

In embodiments, the well region 409 and 410 a-410 d can be formed by anysuitable process, such as ion implantation and/or a rapid thermalprocess (RTP) to activate the doped regions. The isolation structure 407can be formed by, for example, an STI process, a LOCOS process, and/ orother suitable method of forming isolation structures. As one example,the formation of an STI may include patterning the semiconductorsubstrate by a conventional photolithography process, etching a trenchin the substrate (for example, by using a dry etching, wet etching,and/or plasma etching process), and filling the trench (for example, byusing a chemical vapor deposition process) with a dielectric material.In some embodiments, the filled trench may have a multi-layer structuresuch as a thermal oxide liner layer filled with silicon nitride orsilicon oxide.

Referring to FIG. 4C, a doped region 411 can be formed within the wellregion 405. Doped regions 413 a-413 d and 415 a-415 d can be formed inthe well regions 410 a-410 d, respectively. In some embodiments, thedoped regions 411 and 413 a-413 d can be formed by a single implantationprocess. The doped regions 411, 413 a-413 d, and 415 a-415 d can beformed by any suitable process, such as ion implantation and/or a rapidthermal process (RTP) to activate the doped regions.

Gate electrode 420 a can be formed between and over the well region 410a and the isolation structure 407. Each of the gate electrodes 420 b-420d can be formed between and over any two neighboring well regions of thewell regions 410 a-410 d. In embodiments, the gate electrodes 420 a-420e can be electrically coupled with each other.

In embodiments, the gate electrode 420 a-420 e can be formed over gatedielectric structures (not labeled). The gate electrodes 420 a-420 e canbe formed by any suitable process, such as atomic layer deposition(ALD), chemical vapor deposition (CVD), wet oxidation, physical vapordeposition (PVD), remote plasma CVD (RPCVD), plasma enhanced CVD(PECVD), metal organic CVD (MOCVD), sputtering, plating, other suitableprocesses, and/or combinations thereof. In some embodiments, a silicidestructure can be formed over the gate electrodes 420 a-420 e. Thesalicidation process may react a deposited metallic material and thegate electrode at an elevated temperature that is selected based on thespecific material or materials. This is also referred to as annealing,which may include a RTP. The reacted silicide may require a one step RTPor multiple step RTPs.

Referring to FIG. 4D, a dielectric structure 430 can be formed over thegate electrodes 420 a-420 e. Contact plugs 435 a-435 f can be formed inthe dielectric structure 430 and electrically coupled with the dopedregion 411, the gate electrode 420 a, and the doped regions 415 a-415 d,respectively. Metal layers 440 a-440 f can be formed over the dielectricstructure 430 and electrically coupled with the contact plugs 435 a-435f, respectively.

The dielectric layer 430 may be formed by depositing a dielectricmaterial by CVD, ALD, PVD, other suitable processes, or combinations ofthe processes. The contact plugs 435 a-435 fc can be formed by, forexample, patterning the dielectric layer 430 by a photolithographyprocess, etching contact holes in the dielectric layer 430 (for example,by using a dry etching, wet etching, and/or plasma etching process), andfilling the trench (for example, by using a chemical vapor depositionprocess) with at least one metallic material.

The metal layers 440 a-440 f can be formed by, for example, depositing ametallic material by CVD, ALD, PVD, and/or suitable processes over thedielectric layer 430. A photolithographic process and etch process canbe performed to pattern the metallic material, defining the metalliclayers 440 a-440 f.

In some embodiments, additional dielectric materials, via plugs,metallic regions, and/or metallic lines can be formed over the metalliclayers 440 a-440 f for interconnection. The via plugs, metallic regions,and/or metallic lines can include materials such as tungsten, aluminum,copper, titanium, tantalum, titanium nitride, tantalum nitride, nickelsilicide, cobalt silicide, other proper conductive materials, and/orcombinations thereof. The via plugs, metallic regions, and/or metalliclines can be formed by any suitable processes, such as deposition,photolithography, and etching processes, and/or combinations thereof.

FIG. 5 is a schematic drawing of a system that includes an exemplaryembodiment of an integrated circuit disposed over a substrate board. InFIG. 5, a system 500 can include an integrated circuit 502 disposed overa substrate board 501. The substrate board 501 can include a printedcircuit board (PCB), a printed wiring board and/or other carrier that iscapable of carrying an integrated circuit. The integrated circuit 502can include the HV devices 100 and/or 200 described above in conjunctionwith FIGS. 1 and 2, respectively. The integrated circuit 502 can beelectrically coupled with the substrate board 501. In some embodiments,the integrated circuit 502 can be electrically coupled with thesubstrate board 501 through bumps 505. In other embodiments, theintegrated circuit 502 can be electrically coupled with the substrateboard 501 through wire bonding. The system 500 can be a part of anelectronic system such as computers, wireless communication devices,computer-related peripherals, entertainment devices, or the like.

In some embodiments, the system 500 including the integrated circuit 502can provides an entire system in one IC, so-called system on a chip(SOC) or system on integrated circuit (SOIC) devices. These SOC devicesmay provide, for example, all of the circuitry needed to implement acell phone, personal data assistant (PDA), digital VCR, digitalcamcorder, digital camera, MP3 player, or the like in a singleintegrated circuit.

The foregoing outlines features of several embodiments so that thoseskilled in the art may better understand the aspects of the presentdisclosure. Those skilled in the art should appreciate that they mayreadily use the present disclosure as a basis for designing or modifyingother processes and structures for carrying out the same purposes and/orachieving the same advantages of the embodiments introduced herein.Those skilled in the art should also realize that such equivalentconstructions do not depart from the spirit and scope of the presentdisclosure, and that they may make various changes, substitutions, andalterations herein without departing from the spirit and scope of thepresent disclosure.

What is claimed is:
 1. A high voltage (HV) device comprising: a wellregion of a first dopant type disposed in a substrate; a first wellregion of a second dopant type disposed in the well region of the firstdopant type; an isolation structure at least partially disposed in thewell region of the first dopant type; a first gate electrode disposedover the isolation structure and the first well region of the seconddopant type; a second well region of the second dopant type disposed inthe well region of the first dopant type, the second well region of thesecond dopant type being spaced from the first well region of the seconddopant type; a second gate electrode disposed between and over the firstwell region of the second dopant type and the second well region of thesecond dopant type; a buried well region of the first dopant typedisposed below the well region of the first dopant type; and a thirdwell region of the second dopant type disposed between the well regionof the first dopant type and the buried well region of the first dopanttype, wherein the third well region of the second dopant type iselectrically coupled with the first well region of the second dopanttype.
 2. The HV device of claim 1 further comprising: a doped region ofthe first dopant type disposed in the well region of the first dopanttype.
 3. The HV device of claim 2, wherein the buried well region islonger than the third well region.
 4. The HV device of claim 2, whereinthe doped region of the first dopant type is configured to receive afirst voltage, the first well region of the second dopant type and thethird well region of the second dopant type are configured to receive asecond voltage that is smaller than the first voltage, and the firstgate electrode and the second gate electrode are configured to receive athird voltage for turning on a first channel and a second channel underthe first gate electrode and the second gate electrode, respectively,such that a first current flows between the first well region of thesecond dopant type and the doped region of the first dopant type throughthe well region of the first dopant type and a second current flowsbetween the second well region of the second dopant type and to thedoped region of the first dopant type through the well region of thefirst dopant type and the buried well region of the first dopant type.5. The HV device of claim 4 further comprising: at least one fourth wellregion of the second dopant type disposed in the well region of thefirst dopant type, the at least one fourth well region of the seconddopant type being spaced from the second well region of the seconddopant type; and at least one third gate electrode disposed between andover the second well region of the second dopant type and the at leastone fourth well region of the second dopant type.
 6. The HV device ofclaim 5, wherein the at least one fourth well region of the seconddopant type is configured to receive the second voltage, and the atleast one third gate electrode is configured to receive the thirdvoltage for turning on a third channel under the at least one third gateelectrode, such that a third current flows between the at least onefourth well region of the second dopant type and the doped region of thefirst dopant type through the well region of the first dopant type andthe buried well region of the first dopant type.
 7. The HV device ofclaim 1 further comprising: at least one first metallic layer disposedover and electrically coupled with the first gate electrode, wherein theat least one first metallic layer extends along a direction of a channelunder the first gate electrode; and at least one second metallic layerdisposed over and electrically coupled with a doped region of the firstdopant type disposed in the well region of the first dopant type,wherein the at least one second metallic layer extends along thedirection of the channel under the first gate electrode.
 8. The HVdevice of claim 7 further comprising an electrode structure over theisolation structure, wherein the electrode structure is electricallycoupled with the at least one second metallic layer.
 9. A high voltage(HV) device comprising: a well region of a first dopant type disposed ina substrate; a doped region of the first dopant type disposed in thewell region of the first dopant type; a buried well region of the firstdopant type disposed below the well region of the first dopant type; afirst well region of a second dopant type disposed in the well region ofthe first dopant type; an isolation structure at least partiallydisposed in the well region of the first dopant type; a first gateelectrode disposed over the isolation structure and the first wellregion of the second dopant type; a second well region of the seconddopant type disposed in the well region of the first dopant type, thesecond well region of the second dopant type being spaced from the firstwell region of the second dopant type; a second gate electrode disposedbetween and over the first well region of the second dopant type and thesecond well region of the second dopant type; and a third well region ofthe second dopant type disposed between the well region of the firstdopant type and the buried well region of the first dopant type, whereinthe third well region of the second dopant type is electrically coupledwith the first well region of the second dopant type and the buried wellregion is longer than the third well region.
 10. The HV device of claim9, wherein the doped region of the first dopant type is configured toreceive a first voltage, the first well region of the second dopant typeand the third well region of the second dopant type are configured toreceive a second voltage that is smaller than the first voltage, and thefirst gate electrode and the second gate electrode are configured toreceive a third voltage for turning on a first channel and a secondchannel under the first gate electrode and the second gate electrode,respectively, such that a first current flows between the first wellregion of the second dopant type and the doped region of the firstdopant type through the well region of the first dopant type and asecond current flows between the second well region of the second dopanttype and the doped region of the first dopant type through the wellregion of the first dopant type and the buried well region of the firstdopant type.
 11. The HV device of claim 10 further comprising: at leastone fourth well region of the second dopant type disposed in the wellregion of the first dopant type, the at least one fourth well region ofthe second dopant type being spaced from the second well region of thesecond dopant type; and at least one third gate electrode disposedbetween and over the second well region of the second dopant type andthe at least one fourth well region of the second dopant type.
 12. TheHV device of claim 11, wherein the at least one fourth well region ofthe second dopant type is configured to receive the second voltage, andthe at least one third gate electrode is configured to receive the thirdvoltage for turning on a third channel under the at least one third gateelectrode, such that a third current flows between the at least onefourth well region of the second dopant type and the doped region of thefirst dopant type through the well region of the first dopant type andthe buried well region of the first dopant type.
 13. The HV device ofclaim 9 further comprising: at least one first metallic layer disposedover and electrically coupled with the first gate electrode, wherein theat least one first metallic layer extends along a direction of a channelunder the first gate electrode; and at least one second metallic layerdisposed over and electrically coupled with a doped region of the firstdopant type disposed in the well region of the first dopant type,wherein the at least one second metallic layer extends along thedirection of the channel under the first gate electrode.
 14. The HVdevice of claim 13 further comprising an electrode structure over theisolation structure, wherein the electrode structure is electricallycoupled with the at least one second metallic layer.
 15. A high voltage(HV) device comprising: a well region of a first dopant type disposed ina substrate, the well region of the first dopant type having a firstedge and a second edge; a first well region of a second dopant typedisposed in the well region of the first dopant type; an isolationstructure at least partially disposed in the well region of the firstdopant type between the first well region of the second dopant type andthe first edge of the well region of the first dopant type; a first gateelectrode disposed over the isolation structure and the first wellregion of the second dopant type; a second well region of the seconddopant type disposed in the well region of the first dopant type betweenthe first well region and the second edge of the well region of thefirst dopant type, the second well region of the second dopant typebeing spaced from the first well region of the second dopant type; asecond gate electrode disposed between and over the first well region ofthe second dopant type and the second well region of the second dopanttype; a drain region disposed in the well region of the first dopanttype between the isolation structure and the first edge of the wellregion of the first dopant type, wherein the well region of the firstdopant type does not have another drain region between the isolationstructure and the second edge of the well region of the first dopanttype; a first dielectric structure disposed over the first gateelectrode and the second gate electrode; a second dielectric structuredisposed over the first dielectric structure; and at least one metallayer disposed over the second dielectric structure, the at least onemetal layer in electrical connection with the first gate electrode. 16.The HV device of claim 15, further comprising: a buried well region ofthe first dopant type disposed below the well region of the first dopanttype; and a third well region of the second dopant type disposed betweenthe well region of the first dopant type and the buried well region ofthe first dopant type, wherein the third well region of the seconddopant type is electrically coupled with the first well region of thesecond dopant type.
 17. The HV device of claim 16, wherein the thirdwell region of the second dopant type is in physical contact with thefirst well region of the second dopant type.
 18. The HV device of claim15, wherein the drain region comprises a doped region of the firstdopant type disposed in the well region of the first dopant type. 19.The HV device of claim 15, further comprising: an electrode structuredisposed over the isolation structure; and the drain region comprising adoped region of the first dopant type disposed in the well region of thefirst dopant type, wherein the doped region of the first dopant type iselectrically connected to the electrode structure.
 20. The HV device ofclaim 15, wherein a space between the first well region of the seconddopant type and the second well region of the second dopant type is freeof isolation structures.